An N-Type Thermogalvanic Cell with a High Temperature Coefficient Based on the Cu/Cu(en)22+ Redox Couple (2025)

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    ACS Applied Materials & Interfaces

    Cite this: ACS Appl. Mater. Interfaces 2025, XXXX, XXX, XXX-XXX

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    https://pubs.acs.org/doi/10.1021/acsami.5c03375

    Published April 22, 2025

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    An N-Type Thermogalvanic Cell with a High Temperature Coefficient Based on the Cu/Cu(en)22+ Redox Couple (4)

    Thermogalvanic cells (TGCs) are at the forefront of effective thermoelectric conversion methods, but the practical utilization of their integrated devices is hindered by the suboptimal performance of N-type TGCs. Herein, a novel redox couple of Cu/Cu(en)22+ is proposed to construct a liquid-state N-type TGC. The electrochemical reaction involving the Cu electrode, ethylenediamine (en), and their chelated compound Cu(en)22+ exhibits a significant reaction entropy change, resulting in an enhanced temperature coefficient (α). We reveal that the α of the Cu/Cu(en)22+-based TGC reaches 1.64 mV K–1. Furthermore, by optimizing the concentrations of Cu2+, ethylenediamine, and (NH4)2SO4 in the electrolyte, both α and normalized power density can be significantly improved, achieving values of 2.12 mV K–1 and 676 μW m–2 K–2, respectively. Moreover, by constructing a P–N junction with P-type and N-type TGC, we achieve a high potential of 121 mV under a temperature gradient of 35 K. This work expands the available redox couple options for N-type TGCs and offers a new pathway for efficient thermoelectric conversion.

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    • Electrodes
    • Electrolytes
    • P-N junction
    • Power
    • Redox reactions

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    ACS Applied Materials & Interfaces

    Cite this: ACS Appl. Mater. Interfaces 2025, XXXX, XXX, XXX-XXX

    Click to copy citationCitation copied!

    Published April 22, 2025

    Publication History

    • Received

    • Accepted

    • Revised

    • Published

      online

    © 2025 American Chemical Society

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